低温共烧陶瓷(LTCC)技术新进展Recent progress on low temperature co-fired ceramics (LTCC) technology
杨邦朝,付贤民,胡永达
摘要(Abstract)：
介绍了低温共烧陶瓷(LTCC)技术的特点,并详细介绍了LTCC技术在零收缩基板及内埋置材料方面的最新技术,综述了LTCC技术在高密度封装以及微波无源元件领域中的应用。最后介绍了国内外LTCC器件的发展现状,并展望了LTCC技术的未来发展趋势。
关键词(KeyWords)： 电子技术;LTCC;综述;封装;微波无源元件
基金项目(Foundation):
作者(Author): 杨邦朝,付贤民,胡永达
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